GRENOBLE, FRANCE - Media OutReach - 11 March 2019 - Teledyne e2v, an aerospace qualified
manufacturer of advanced semiconductors, has qualified and released the first upscreened
processor from NXP’s new Layerscape® Series, the LS1046A, to operate
at 55°C to 125°C. The LS1046A is part of NXP’s 64-bit Arm® Layerscape
portfolio that, implements a quad-core Arm® Cortex® A72 design
providing unparalleled performance in the smallest form factor possible while
enabling access to the vast ecosystem of software services, applications and tools
compatible with Arm® technology.
The LS1046A from NXP is a 1.8GHz processor integrating
packet processing acceleration with high-speed peripherals and is recognized
for its high-performance architecture and market-leading compute density. The
LS1046A, offering more than 45,000 CoreMarks® of compute performance,
paired with dual 10Gb Ethernet, PCIe Gen3, SATA Gen3 is suitable for a range of
high reliability mil-aero applications. The Teledyne e2v military qualification
of this device assures its functionality between -55°C and 125°C and is available in both RoHS and leaded packages. In addition, as part of Teledyne e2v’s Semiconductor Lifecycle
Management program, SLiM, the lifetime of this device can be supported for 15+
years, avoiding common and costly obsolescence issues.
“We see a new trend developing in the Aerospace and Defense industry toward
64-bit Arm®-based products with the Teledyne e2v military qualified device from
our Layerscape Series of commercial processors,” commented Altaf Hussain,
Marketing Manager for NXP. “We believe e2v customers will not only leverage the
advanced computing performance of the device but also the ecosystem that
supports Arm®, creating new possibilities in system design.”
Teledyne e2v is now offering a broad range of
devices to its Aerospace & Defense customers; its portfolio includes many
PowerPC®-based qualified and supported processors from the NXP QorIQ®
P- and T-Series, as well as the more traditional PowerQUICC®
devices. Customers can continue using their Power Architecture-based software
and applications, while Teledyne e2v continues to develop solutions on newer
technologies such as Arm®-based solutions from NXP. Customers may
either transition to Arm®-based solutions or start new developments with
proven Power® Architecture-based solutions from NXP. The LS1046A is
also the chosen device to be embedded into Teledyne e2v’s latest Qormino®
computing module, which also includes a 4GB DDR4 memory (for more information,
please check our website: www.teledyne-e2v.com/products/semiconductors/qormino).
Thomas Guillemain, Marketing and Business Development Manager of Digital
Processing Solutions at Teledyne e2v, commented, “The release of our first
military qualified device from NXP’s Layerscape Series is a signal of our
continued efforts to support new and existing lines from NXP. I am proud of our
processor portfolio offering with all the military versions of NXP’s T-Series,
P-Series and PowerQUICC® based processors. The introduction of NXP’s
Layerscape Series and the qualification of the LS1046A is a major step in allowing
our customers to benefit from the wide Arm® ecosystem in their
applications.”
For more information, visit e2v.com/LS1046A.
Notes to
Editors:
Teledyne e2v’s innovations lead developments in
healthcare, life sciences, space, transportation, defence and security and
industrial markets. Teledyne e2v’s unique approach involves listening to the
market and application challenges of customers and collaborating with them to
provide innovative standard, semi-custom or fully custom solutions, bringing
increased value to their systems.
Teledyne e2v is a world leader in
re-engineering and up-screening commercial technologies and has held a
strategic partnership with NXP for over 30 years to develop space, military and
industrial grade versions of NXP’s commercial processors. With access to
original test vectors, Teledyne e2v offers guaranteed extended reliability
versions of a broad line of the QorIQ® Power®
Architecture based portfolio and is developing solutions based on NXP’s
Layerscape Series.
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