Fibocom Launches Intel� XMM� 8160 Powered Global 5G Module

SHENZHEN, CHINA; BARCELONA, SPAIN�- Media OutReach - February 26, 2019 – FIBOCOM
Wireless (SHE:300638) unveils its Intel powered 5G module for the global
vertical markets at the
Mobile World Congress in Barcelona, Spain. FG100, the first of Fibocom’s
5G family modules, featuring the Intel® XMM™ 8160 5G modem, offers a “One
World One SKU” solution to enable 5G globally with a standardized M.2 form
factor. 

 

FG100 is a multi-mode 5G module that includes EN-DC (LTE+5G), 5GNR-FDD/TDD, LTE-FDD/TDD and
3G WCDMA, supports 5G Sub-6 GHz internally, and
supports mmW through an external antenna module. It allows blazing download
speeds of up to 6Gbps on mmW and 4Gbps on Sub-6 GHz. The improved and uniform
data rates in bandwidth enable cloud-connected, immersive experiences of mobile
broadband such as Virtual Reality or Augmented Reality.  

 

“We
at Fibocom are proud to present our first 5G module based on Intel’s XMM™ 8160
5G modem. 5G allows for enhanced experience in speed and capacity with ultra-low
latency,” says Tiger Ying, CEO Fibocom. “Building upon our established M.2
modules portfolio with Intel modems, our FG100 enables our customers with the
natural migration and easy integration from 4G to 5G.”

 

FG100’s One-World-One-SKU multi-mode,
global band support, compliant to both NSA and SA networks, offers a similar
architecture and identical interface to its 4G predecessor, and commercially
available L860, with Intel® XMM™ 7560 Gigabit LTE modem.  Both offer PCIe interface (Gen4 for FG100),
MIPI and GPIO antenna ports, standard M.2 form factor with global bands, to
allow for a 5G ready platform on the proven 4G LTE network, significantly
improving time to market on 5G vertical solutions such as computing devices, fixed
wireless access, and gateways.

 

To enable fast adoption of 5G in
the vertical markets, Intel and Fibocom have collaborated on a prototype
Thunderbolt™ 3 adapter being demonstrated in the Intel booth at MWC.  This adapter enables Windows-based devices
with Thunderbolt™ 3 ports to have easy cellular connectivity on the go.
Initially designed with the Intel® XMM™ 7560 Gigabit LTE modem, the adapter can
be upgraded to the Intel® XMM™ 8160 5G modem when available. A 5G Thunderbolt 3
adapter will deliver on the promise of plug and play broadband connectivity on
the go, and requires no external power since it derives power from the host
platform.

 

“5G’s
revolutionary aspect is in its ability to connect all types of devices and
become more than just a speed bump for faster phones,” says Chenwei Yan, VP
& GM Intel’s Connected Products and Programs.  “Fibocom’s FG100 will help the industry scale
5G to multiple market segments including PC’s, gateways, IOT devices, and
vehicles to deliver experiences that benefit from lower latency, expanded
capacity, and enhanced broadband speeds.”

 

Partners including Arcadyan, D-Link,
Gemtek and VVDN will deliver gateway platforms using the Fibocom L860 gigabit
LTE M.2 module with plans to upgrade to the FG100 5G M.2 module when available.
Thanks to the module’s standardized interface and seamless upgradability, the
transition from 4G to 5G is an easy upgrade for customers and allows them to
leverage the investment in their 4G platforms.

 

Our partners shared the following
comments:

 

D-Link

“This partnership will bring 5G into the home. Our
residential gateways will enable Smart Homes to fulfill their promise of
always-on connectivity of every consumer device, while unleashing a new
generation of online immersion and entertainment in the home, defined by
seamless Augmented Reality that is lag-free, and 4K/8K gaming, video, and
Virtual Reality with a high frame-rate,” says G.K. Lee, VP D-Link.

 

Gemtek

“Fibocom’s 4G and 5G modules with
Intel XMM modem inside provide a clear and achievable path from 4G to 5G
evolution. We are glad to cooperate with Fibocom and Intel to create 5G ready
solutions to our customers,” says Fred Yeh, CTO Gemtek.

 

VVDN

“We are excited to be a part of the eco-system
to bring 5G into action. The teaming up of Fibocom, Intel and VVDN will empower
the first wave of 5G based gateway solution. The 5G IoT Gateway will capture
the interest and imagination of OEMs who are looking for expanded capacity,
enhanced speeds and low latency,” says Vivek Bansal, President Engineering,
VVDN Technologies.

 

FG100 will be available to sample
this year, with commercial availability in 2020. For more information regarding
Fibocom’s product offerings, please contact market@fibocom.com,
or visit our booth at MWC Barcelona 2019, Hall 1, 1E21.

About Fibocom

Fibocom Wireless INC.
(SHE:300638), is a leading global provider of wireless modules for the Internet
of Things (IoT).  We provide cellular
communications modules of 5G, LTE, NB-IOT, eMTC, HSPA+ and GSM/GPRS solutions
that enable secure IoT applications globally across many verticals.  For
over 20 years, we have been delivering a trusted and secure environment in
telematics, wireless retail systems, metering and smart grids, security
systems, routers and gateways, digital signage and mobile internet. Our global
sales channel, logistics, manufacturing and support allow enterprises to
simplify operations, increase efficiency and create new business models.
Headquartered Shenzhen, China, our global office locations include Germany,
India, Taiwan and the United States. www.fibocom.com