DUBLIN--(BUSINESS WIRE)--The "Asia Pacific Advanced IC Substrates Market 2022-2031 by Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country: Trend Forecast and Growth Opportunity" report has been added to ResearchAndMarkets.com's offering.

Asia Pacific advanced IC substrates market will grow by 7.6% annually with a total addressable market cap of $92,888.8 million over 2023-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.

This 131-page report is based on a comprehensive research of the entire Asia Pacific advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year.

In-depth qualitative analyses include identification and investigation of the following aspects:

• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter's Five Forces

The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.

Based on Packaging Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• FC BGA
• FC CSP
• Other Packaging Types

Based on Material Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate

By Manufacturing Method, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)

By Bonding Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)

By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.

• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications

Geographically, the following national/local markets are fully investigated:

• Japan
• China
• South Korea
• Australia
• Taiwan
• Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)

For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included.

The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.

Key Topics Covered:

1 Introduction

2 Market Overview and Dynamics

3 Segmentation of Asia Pacific Market by Packaging Type

3.1 Market Overview by Packaging Type

3.2 FC BGA

3.3 FC CSP

3.4 Other Packaging Types

4 Segmentation of Asia Pacific Market by Material Type

4.1 Market Overview by Material Type

4.2 Rigid Integrated Circuit Substrate

4.3 Flex Integrated Circuit Substrate

4.4 Ceramic Integrated Circuit Substrate

5 Segmentation of Asia Pacific Market by Manufacturing Method

5.1 Market Overview by Manufacturing Method

5.2 Subtraction Process (SP)

5.3 Addition Process (AP)

5.4 Modified Semi-additive Process (MSAP)

6 Segmentation of Asia Pacific Market by Bonding Technology

6.1 Market Overview by Bonding Technology

6.2 Wire Bonding

6.3 FC Bonding

6.4 Tape Automated Bonding (TAB)

7 Segmentation of Asia Pacific Market by Application

7.1 Market Overview by Application

7.2 Mobile and Consumer Electronics

7.3 Automotive and Transportation

7.4 IT and Telecom

7.5 Other Applications

8 Asia-Pacific Market 2021-2031 by Country/Region

8.1 Overview of Asia-Pacific Market

8.2 Japan

8.3 China

8.4 Australia

8.5 Taiwan

8.6 South Korea

8.7 Rest of APAC Region

9 Competitive Landscape

Companies Mentioned

• ASE Group
• AT&S Austria Technologie & Systemtechnik AG
• Fujitsu Ltd.
• IBIDEN Co., Ltd.
• Kinsus Interconnect Technology Corp.
• Korea Circuit Co., Ltd.
• KYOCERA Corporation
• LG Innotek Co., Ltd.
• Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
• Shenzhen Fastprint Circuit Tech
• Shinko Electric Industries Co., Ltd.
• Siliconware Precision Industries Co., Ltd.
• STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
• TTM Technologies Inc.
• Unimicron Corporation
• Zhen Ding Technology Holding Ltd.
• Zhuhai ACCESS Semiconductor

For more information about this report visit https://www.researchandmarkets.com/r/fo2o7d

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