A Strategic Collaboration with the Best-in-Class to craft the future of Smart Manufacturing for Semiconductor Assembly and Testing
TAIPEI, Taiwan–(BUSINESS WIRE)–Advanced Semiconductor Engineering, Inc (ASE, a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX), participated in a project kick-off event on August 23rd to unveil plans for a 5G mmWave NR-DC SA (New Radio-Dual Connectivity Standalone) smart factory supported by the Industrial Development Bureau and Qualcomm Technologies Inc., and developed through a strategic multi-organizational collaboration that comprises the Institute for Information Technology, Asia Pacific Telecom, DEVCORE Security Consulting and the National Cheng Kung University�s Intelligent Manufacturing Research Center.
With the increasing complexity of global competition characterized by the rapid shifts in market supply and demand, as well as human resource constraints, companies continue to face unprecedented challenges in upgrading and transforming their business operations. To counter the talent crunch and adapt to diverse customer requirements, ASE is accelerating its adoption of smart manufacturing technologies including automation, and the integration of OT (operational technology) security to increase the efficiency of its equipment and productivity. In line with the companys vision of building advanced and robust smart factories, ASE has partnered with leading industry players, and key government, academic and research institutions in converging AI applications with 5G technologies.
Overview of the 5G Collaboration
The collaboration will focus on enabling the digital transformation of factory processes that are highly secured and highly reliable through facilitating 5G wireless infrastructure integration, smart heterogeneous equipment integration and OT security system integration. Areas covered include developments in:
Snapdragon® X65 5G Modem-RF System and New Radio Dual Connectivity for Standalone 5G
The smart factory will utilize the Snapdragon X65 5G Modem-RF System and 5G NR-DC software with uplink four-component carrier aggregation (UL 4CC CA), in which four contiguous carriers of 100MHz are combined together with 2.6GHz (mid-band) and 28GHz (high-band), to achieve an uplink speed of 600Mbps. The low latency and higher data speeds are critical to semiconductor manufacturing environments for advanced processes and will in turn accelerate the application and development of smart manufacturing.
Uniting with the Best in Class to Chart the Course of the Next Generation 5G Smart Factory
Asia Pacific Telecoms vast experience in enterprise wireless networks will be instrumental in deploying next-generation 5G network architecture within a manufacturing environment. Today marks an important milestone, as leading players in the industry, government, academia and research sectors joined forces to drive the developments of smart factory technologies. Such engagement will contribute to greater innovation in digital transformation and intelligent automation, and strengthen the global competitiveness of the semiconductor industry.
The success of Taiwans semiconductor industry and its importance in the global supply chain are the results of many factors, of which strategic initiatives led by the Economic Ministry have laid a strong foundation for the industry to grow and prosper. At ASE, partnerships are key to advancing our competitiveness and seizing new opportunities across diverse disciplines, generations and global borders. To that end, we are collaborating with the best-in-class from the government, industry, academia and research institutions to craft a 5G smart manufacturing blueprint that optimizes technologies in 5G mmWave NR-DC SA, and establishes an open platform with integrated software/hardware and smart systems. We hope to lead by example and inspire more industry players to contribute to building a resilient global smart manufacturing and equipment cluster, and boost the development of semiconductor talent.
– Tien Wu, CEO, ASE Inc
As a global leader in 5G technology, we believe that the next step in the 5G evolution is to move towards standalone mode and allow for industry growth in areas such as Industrial IoT and cloud services. This announcement again illustrates the importance of Taiwans comprehensive ICT supply chain and its technological advantages, so as how Qualcomm Technologies has always attached great value to Taiwans industry and ecosystem. We are excited to take part in driving the much needed development of technologies in a transforming industry. We will continue to support Taiwans development of mmWave technology and work together to strengthen Taiwans 5G ecosystem.
– ST Liew, Vice President, QUALCOMM CDMA Technologies Asia-Pacific Pte. Ltd. and President, Qualcomm Taiwan, South East Asia, Australia and New Zealand.
Asia Pacific Telecom is committed to technological innovation and the development of the 5G industry. Our strengths in integrating 5G enterprise private networks and vertical applications have led to the completion of Taiwan’s first 5G NR-DC SA network with Ericsson and Qualcomm Technologies. The network architecture in the mid-to-high frequency band offers excellent data speeds with extremely low latency, creating a more flexible, intelligent, secure and reliable environment to build a 5G mmWave NR-DC SA smart factory. We are proud to establish the next milestone in the application of 5G enterprise networks and participate in accelerating Taiwans industry upgrade.
– Peng Chen, Chairman and General Manager, Asia Pacific Telecom
Besides Qualcomm Technologies, the Institute for Information Technology, Asia Pacific Telecom, DEVCORE Security Consulting and the National Cheng Kung Universitys Intelligent Manufacturing Research Center, other members of the collaborative team include Askey, Ericsson and FHNet.
About ASE
Advanced Semiconductor Engineering, Inc (a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, Automotive, High Performance Computing and more. To learn about our advances in SiP, Fanout, MEMS & Sensor, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: www.aseglobal.com or follow us on Twitter and LinkedIn @aseglobal.
About Asia Pacific Telecom
A leader in the provision of wireless telecom needs in Taiwan, Asia-Pacific Telecom Co., Ltd. was founded in 2000 as a subsidiary of Asia-Pacific Telecom Group, formerly Eastern Broadband Communications Co., Ltd. From 2007 through 2011, the parent company carried out internal mergers to match the firms corporate strategy. What resulted–Broadband Fixed Lines, Broadband Wireless, and Broadband Internetenabled to the firm to move ahead in line with three core valuesintegration, innovation, and speedtoward greater operational efficiency and competitiveness. The company was officially renamed Asia Pacific Telecom Co., Ltd. (APT) in 2007 and had its IPO in 2013. In July 2014, Hon Hai Technology Groups Ambit Microsystems acquired a stake in Asia-Pacific (Ambit was fully absorbed into APT on December 31, 2015). In late 2014, APT launched 4G brand Gt Smart Life. Asia Pacific Telecom officially launches the 5G service in 2020 and provides premium services by using its ICT experiences and import Hon Hai Technology Group’s manufacturing, platform, and terminal equipment resources to provide comprehensive telecommunications, ICT, IoT solutions and digital application services. For information, visit https://www.aptg.com.tw/my/
Snapdragon is a trademark or registered trademark of Qualcomm Incorporated.
Snapdragon is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.
Contacts
ASE Media Contact : jennifer.yuen@aseus.com
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