Low temperature curing adhesive JU-90LT-3 has curing temperatures of 90-100 �C, nearly 40 �C lower than their conventional counterparts. This feature makes it ideal for use in soldering heat-sensitive components and boards.

JU-R4S is developed for reflow soldering and prevents the components on the bottom-side of the board from falling, shifting or floating during double-sided reflow.

Both products are meant for dispensing applications with stable dispense shape during continuous use, and retaining excellent electrical reliability after curing,

Product Features:

JU-90LT-3
- Heat curable surface mount adhesive for dispensing
- Low curing temperature mitigates damage to the PCB and the components
- Superior heat slump resistance allows it to retain its height during the curing process

JU-R4S
- Heat curable SMT adhesive for dispensing, designed for reflow soldering process
- Allows solder paste self-alignment during reflow
- Retains stable dispense shape during continuous use